①Integrated Matrix Device (IMD) solution, smaller pixel pitch 0.78, flip chip design and energy saving
②Integrated Matrix Device (IMD) solution, 8 pins design, solve the problems of soldering strength and crash.
③All flip chip design, better reliability.
④Black matt finish encapsulation, no specular reflection, higher brightness and contrast, higher definition image display
⑤Achieve to the seamless combination, no modular color difference in whole screen, 100% tested and binning, better color consistency.
Product Name |
Color |
IF(mA) TEST |
λd(nm) Typ |
Iv(mcd) Typ |
Vf(V) Typ |
View angle (deg.) |
IMD-M07
|
5 | 620 | 33 | 2.0 | 120 | |
2 | 535 | 35 | 2.5 | 120 | ||
2 | 464 | 5.5 | 2.6 | 120 |